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The main contract of CSI 500 stock index futures (IC) expanded to 1.00% in the day and is now reported at 6104.4 points. The main contract of CSI 500 stock index futures (IC) stood at 6100 points, rising by 0.99% in the day.Indian Trade Secretary: India will need more imports to maintain high growth, and should not be too worried about the trade deficit.Li Bin: Fang Hongbo, chairman of Midea, will be the chief experience officer of Weilai ET9 and will test drive together. Li Bin, founder, chairman and CEO of Weilai, announced that Weibo said that Fang Hongbo, chairman of Midea, will be the chief experience officer of Weilai ET9 and test drive this upcoming administrative flagship together. Li Bin said that he asked Fang Hongbo three questions, and Fang Hongbo's answer about market competition was very good: "Actively participate in involution, compare cost and efficiency, and at the same time bravely jump out of involution, don't roll on the floor, and pierce the ceiling." (Sina Technology)

Intel: Breakthrough progress has been made in chip interconnection, and the inter-line capacitance has been reduced by 25%. Recently, Intel OEM announced a major breakthrough in on-chip interconnection technology. The latest subtractive Ruthenium interconnection technology of the company can reduce the inter-line capacitance by up to 25%, effectively improving the on-chip interconnection. According to reports, the subtractive ruthenium interconnection technology has achieved great progress in interconnection miniaturization by using ruthenium, a new, key and alternative metallization material, and using thin film resistivity and airgap. This process does not need an expensive photolithographic air gap exclusion zone around the via, and it can also avoid using a self-aligned via that is selectively etched. When the spacing is less than or equal to 25 nm, the air gap realized by reducing ruthenium interconnection technology can reduce the capacitance between lines by up to 25%, which can be used as a metallization scheme to replace copper damascene process in closely spaced layers. It is reported that this solution is expected to be applied in the future process nodes of Intel OEM. (Sina Technology)The Hang Seng Index rose 1.4%, led by Tencent Holdings Limited. The Hang Seng Index rose 1.4% to 20,435.93 in Hong Kong. Tencent Holdings contributed the most to the index rise, rising by 2.4%. Mengniu Dairy has the largest increase, up by 7.0%. In midday trading, 71 of 83 stocks rose and 10 fell; All stocks rose, led by industrial and commercial stocks.Korean media: South Korea's ruling party has added another person to support the impeachment of Yin Xiyue, and the number of members in favor has now increased to six. According to the latest news in Yonhap News Agency, Zhongwu Qin, a member of parliament of South Korea's ruling National Power Party, said on the 12th that he would vote for the impeachment of the president on the 14th. Yonhap News Agency said that so far, the number of members of the ruling party who have publicly expressed their support for the impeachment of President Yin Xiyue has increased to six.

Mizuho listed in Japan to invest in the ETF of Saudi stock market.Minister of Finance Lan Foan attended and delivered a speech at the launching ceremony of the China-World Bank Group Global Ecosystem and Transformation Center. On December 8, the Ministry of Finance and the World Bank jointly held the launching ceremony of the China-World Bank Group Global Ecosystem and Transformation Center (hereinafter referred to as the Global Center). Lan Foan, Minister of Finance, delivered an opening speech with Peng Anjie, President of the World Bank, and signed a memorandum on the Global Center and an agreement on the renewal of the China-World Bank Group Partnership Fund. Liao Minyi, Vice Minister of Finance, and Philo, Vice President of the East Asia and Pacific Region of the World Bank, made closing remarks. More than 100 Chinese and foreign representatives from more than 20 embassies and international organizations in China, as well as relevant domestic departments and research institutions attended the event. Lan Foan emphasized that in the past decade, the central government has invested nearly 6 trillion yuan to fully guarantee the construction of beautiful China. The "gold content" of China's ecological environment has improved significantly, and the "green content" of its development has increased significantly. At the same time, China has assumed the responsibility of a big country, demonstrated its role as a big country, and achieved a major transformation from a participant to a leader in global environmental governance. China is willing to take the global center as a bridge, share China's experience in ecological protection and development, and embark on the road of green transformation together with other countries.Intel: Breakthrough progress has been made in chip interconnection, and the inter-line capacitance has been reduced by 25%. Recently, Intel OEM announced a major breakthrough in on-chip interconnection technology. The latest subtractive Ruthenium interconnection technology of the company can reduce the inter-line capacitance by up to 25%, effectively improving the on-chip interconnection. According to reports, the subtractive ruthenium interconnection technology has achieved great progress in interconnection miniaturization by using ruthenium, a new, key and alternative metallization material, and using thin film resistivity and airgap. This process does not need an expensive photolithographic air gap exclusion zone around the via, and it can also avoid using a self-aligned via that is selectively etched. When the spacing is less than or equal to 25 nm, the air gap realized by reducing ruthenium interconnection technology can reduce the capacitance between lines by up to 25%, which can be used as a metallization scheme to replace copper damascene process in closely spaced layers. It is reported that this solution is expected to be applied in the future process nodes of Intel OEM. (Sina Technology)